PETERMANN時鐘元件的趨勢遙遙領(lǐng)先

時鐘元件的趨勢:更小和更高的頻率穩(wěn)定性

時鐘產(chǎn)品的尺寸和頻率穩(wěn)定性會影響終端設(shè)備的尺寸和功耗。電池供電產(chǎn)品的開發(fā)人員尤其需要精確而緊湊的頻率發(fā)生器——這是振蕩石英市場技術(shù)現(xiàn)狀的概述。
石英晶體(或僅僅是石英)在20世紀(jì)20年代初發(fā)展成為無線電工程中使用的實用石英。今天，我們在現(xiàn)代科技生活中已經(jīng)離不開石英了。近年來，從金屬外殼中的大型THT(通孔技術(shù))和SMD石英(表面貼裝器件)到陶瓷外殼中的小型化SMD石英，出現(xiàn)了重大轉(zhuǎn)變。對更小外殼中更高頻率振蕩石英的需求是這一趨勢的一大驅(qū)動力。由于技術(shù)進(jìn)步和生產(chǎn)中的幾項創(chuàng)新，在不降低性能或增加成本的情況下，大幅縮小振蕩石英的結(jié)構(gòu)尺寸成為可能。
此時此刻外形尺寸為3.2 x 2.5毫米貼片晶振在各種應(yīng)用中大量使用，主要與石英的電阻優(yōu)化有關(guān)，以便在規(guī)定的工作溫度范圍和8.0至64.0 MHz(基音)的頻率范圍內(nèi)獲得最佳振蕩性能。它們可以在高達(dá)500 W的驅(qū)動電平下工作(頻率范圍為12.0至64.0 MHz)。對于要求特別高的應(yīng)用，頻率容差高達(dá)10 ppm的元件和溫度范圍為-55至125攝氏度都是可用的。
過去，陶瓷外殼中的SMD石英的尺寸從2.5 x 2.0毫米外殼(4個襯墊)到3.2 x 2.5毫米外殼(4個襯墊)，并行開發(fā)，但從未真正流行起來。如果3.2 x 2.5 mm外殼太大，您可以依靠中的高容量產(chǎn)品2.0 x 1.6毫米外殼(4片)。這種外殼類型是非常小的應(yīng)用的趨勢。這種外形的石英設(shè)計也經(jīng)過電阻優(yōu)化，設(shè)計用于最佳振蕩行為。開發(fā)者可以使用驅(qū)動電平高達(dá)400 W的版本。
PETERMANN彼得曼晶振生產(chǎn)廠家，外殼更小、頻率穩(wěn)定性更高的趨勢在中也很明顯。尺寸為1.2x1.0mm的最小版本即將發(fā)布。32.768KHz石英在3.2x1.5mm外殼和2.0x1.2mm外殼中，電阻降低，現(xiàn)在在終端設(shè)備中很常見。石英市場上提供32.768 kHz的低電阻石英和標(biāo)準(zhǔn)版本，負(fù)載能力為4至12.5 pF，溫度范圍為-40至+125°C。開發(fā)人員可以在+25°C時選擇兩種頻率容差:10 ppm(可選)或20 ppm(標(biāo)準(zhǔn))。
越來越多的IC制造商將其工作基于集成熱敏電阻的SMD晶振，例如2.0x1.6mm陶瓷外殼。這種石英越來越多地用于電池供電的通信產(chǎn)品，并取代了高功耗(高達(dá)2 mA)的溫度補償石英振蕩器(TCXO)。
因此可以得出這樣的結(jié)論:近年來，在石英的發(fā)展過程中，似乎不可能的事情發(fā)生了。在不損失性能或增加成本的情況下，在外殼尺寸小型化方面取得了進(jìn)展，電子行業(yè)的技術(shù)進(jìn)步用于支持越來越多的創(chuàng)新產(chǎn)品設(shè)計解決方案投入市場。結(jié)果是，隨著外殼尺寸越來越小，頻率穩(wěn)定性越來越高。

PETERMANN時鐘元件的趨勢遙遙領(lǐng)先

TRENDS FOR CLOCKING COMPONENTS: SMALLER AND WITH MORE FREQUENCY STABILITY
The size and frequency stability of clocking pruducts influence the dimensions and power consumption of an end device. The developers of battery-operated products in particular require precise and compact frequency generators – an overview of the current state of technology in the oscillating quartz market.
Quartz crystals (or just quartz) was developed into practicable quartz for use in radio engineering at the start of the 1920s. Today, we simply can’t do without quartz in our modern, technological lives. Over recent years, there has been a significant transition from large THT (Through-Hole-Technology) and SMD quartz (Surface Mounted Device) in metal housings for miniaturised SMD quartz in ceramic housings. The need for higher-frequency oscillating quartz in smaller housings has been a big driver for this trend. Thanks to technological advances and several innovations in production, it became possible to significantly reduce the structural size of the oscillating quartz without cutbacks on performance or increased costs.
At the moment, the form factor 3.2 x 2.5 mm is used a lot in all kinds of applications, mainly in connection with resistance optimisation of the quartz for the optimal oscillation behaviour in the defined working temperature ranges and in the frequency range of 8.0 to 64.0 MHz (AT base tone). They can be operated with a drive level of up to 500 µW (in the frequency range from 12.0 to 64.0 MHz). For particularly demanding applications, components with frequency tolerances of up to ±10 ppm and a temperature range of -55 to 125 °C are available.
In past years, the SMD quartz in ceramic housing with the dimensions from 2.5 x 2.0 mm housing (4 pad) to 3.2 x 2.5 mm housing (4 pad) developed in parallel, but never really caught on. If a 3.2 x 2.5 mm housing is too large, you can rely on the high-volume product in 2.0 x 1.6 mm housing (4-pad). This housing type is on trend for very small applications. The quartz design in this form factor is also resistance-optimised and designed for the optimal oscillation behaviour. The developer can use versions with a drive level of up to 400 µW.
The trend towards smaller housings and a greater frequency stability is also evident in the as well. The smallest version with the dimensions 1.2 x 1.0 mm is just about to be released. 32.768 KHz quartz in 3.2 x 1.5 mm housing and 2.0 x 1.2 mm with reduced resistance is seen a great deal now in end devices. Low-resistance quartz with 32.768 kHz and also the standard versions are available on the quartz market with load capacities from 4 to 12.5 pF in the temperature range from -40 to +125 °C. The developer can select between two frequency tolerances at +25 °C: ±10 ppm (optional) or ±20 ppm (standard).
More and more IC manufacturers are basing their work on SMD quartz with integrated thermistors, for example in a 2.0 x 1.6 mm ceramic housing. This quartz is used more and more in battery-operated communications products and replaces power-consuming (up to 2 mA) temperature-compensated quartz oscillators (TCXO).

It may therefore be concluded that in recent years, things that seemed impossible have occurred in the development of quartz. Progress was made in the miniaturisation of housing sizes without a loss in performance or increase in cost and the technological advances of the electronics sector were used to support getting more and more innovative solutions in product design ready for the market. The result is an ever greater frequency stability with housing sizes that are getting smaller and smaller.

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