嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振,尺寸2.0*1.2mm,頻率32.768KHZ,臺灣晶振,超小型晶振,兩腳貼片晶振,進口音叉晶振,SMD晶振,水晶振動子,無源晶體,石英晶體,音叉晶體,時鐘晶振,32.768KHZ晶振,2016mm貼片晶振,輕薄型晶體,低損耗晶振,低成本晶振,低功耗晶振,高性能晶振,高品質貼片晶振,兒童游戲機晶振,時計專用晶振,數碼相機晶振,電話機晶振,藍牙耳機專用晶振,產品具有輕薄小低損耗的特點.
32.768K晶振產品適用于范圍非常廣泛,比較適合用于兒童游戲機,時計,數碼相機,電話機,藍牙耳機等領域。嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振.
嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振參數表
| TZ2065A | Specification |
| NominalFrequency | 32.768000KHz |
| Storage TemperatureRange | -40°Cto+85°C |
| Operating TemperatureRange | -40°Cto+85°C |
| Turnover Temperature | 25+/-5°C |
| Parabolic CurvatureConstant | -0.027ppm/°C2max. |
| FrequencyMakeTolerance(FL) | +/-20 ppm@25°C+/-3°C |
| EquivalentSeriesResistor(ESR) | 90 Ωmax. |
| Nominal DriveLevel | 10uW |
| ShuntCapacitance(Co) | 2.0 pFmax |
| DriveLevel | 0.5uWmax. |
| LoadCapacitance(CL) | 12.5pF |
| Aging | +/-3.0ppm/year@25°C |
| Marking | Lasermarking |
| InsulationResistance | 500MΩmin atDC100V |
嘉碩32.768K晶體,TZ2065A無源晶振,2012mm小體積晶振,6G無線模塊晶振 尺寸圖
32.768K產品特性:
陶瓷接縫封裝
卓越的可靠性性能
超微型封裝
可用于表面安裝技術和紅外回流工藝
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