BC59,2012mm,BC59CCD112.5-32.768K,Bomar32.768K時(shí)鐘晶振，尺寸2.0x1.2mm，頻率32.768KHZ，兩腳貼片晶振，陶瓷SMD晶體，無源貼片晶振，貼片陶瓷晶振，2012mm音叉晶體，歐美無源晶振，32.768KHZ無源晶振，輕薄型晶振，兩腳貼片晶振，32.768KHZ陶瓷諧振器，超小型SMD晶體，無源晶振，移動(dòng)通信晶振，實(shí)時(shí)實(shí)時(shí)晶振，娛樂設(shè)備晶振，小型設(shè)備晶振，低損耗晶振，低功耗晶振，低成本晶振，高質(zhì)量晶振，高性能晶振，具有高質(zhì)量高性能的特點(diǎn)。
BC59系列是一種超小型陶瓷SMD晶體，高度為0.6毫米。非常適合最小的電路空間可能的應(yīng)用包括移動(dòng)通信、芯片卡、實(shí)時(shí)時(shí)鐘和無線通信。BC59,2012mm,BC59CCD112.5-32.768K,Bomar32.768K時(shí)鐘晶振.
BC59,2012mm,BC59CCD112.5-32.768K,Bomar32.768K時(shí)鐘晶振 參數(shù)表
| Frequency Range | 32.768 kHz | |||||||||
| Frequency Tolerance @ 25ºC. | ±10ppm, ±20ppm, ±50ppm | |||||||||
| Temperature Coefficient | -0.045ppm / ºC² max. - See Graph Below | |||||||||
| Operating Temperature Range | -40º to +85ºC. | |||||||||
| Load Capacitance | 12.5pF, 9.0pF, 7.0pF | |||||||||
| Shunt Capacitance | 2pF max. | |||||||||
| Equivalent Series Resistance | 70k ohms max. | |||||||||
| Aging | ±3ppm/ 1styear max. | |||||||||
| Drive Level | 0.1µW max. | |||||||||
| Storage Temperature | -40º to +85ºC. | |||||||||
BC59,2012mm,BC59CCD112.5-32.768K,Bomar32.768K時(shí)鐘晶振 尺寸圖
BC59,2012mm,BC59CCD112.5-32.768K,Bomar32.768K時(shí)鐘晶振
進(jìn)口音叉晶振產(chǎn)品特點(diǎn):
尺寸2.0x1.2mm
32.768千赫
回流焊接
工作溫度-40º至+85ºC
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